Find great deals for 1x Intel AFIBM BGA Chipset With Lead Solder Balls. Shop with confidence on eBay!. Model Number: AFIBM SLB8Q. Date Code: 1 PCS intel AFIBM SLB8Q BGA Chipset with solder balls. 1 PCS intel . AFIBM. BGA: CHIP. AFIBM S LB8Q Specifications: Manufacturer: Intel ; Product: Mobile Chipsets ; Operating Supply Voltage: V, V, V, 5 V ; Maximum Operating.
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See other items More Prices may vary for other package types and shipment quantities. Please contact system vendor for more information on specific products or systems. Prices are for direct Intel customers, typically represent 1,unit iintel quantities, and are subject to change without notice. This item will ship to United Statesbut the seller has not specified shipping options.
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Learn more – opens in new window af82801kbm tab. Mouse over to Zoom – Click to enlarge. The chips will, as a result, die.
Intel refers to these processors as tray or OEM processors. The temperatures listed above are the chip’s solder balls actual temperatures they are measured by the measuring wire on the Fa82801ibm machine ,but not the temperatures from the BGA rework station’s top bottom heat guns.
This is a private listing and your identity will not be disclosed to anyone except the seller. Listing of these RCP does not constitute a formal pricing offer from Intel.
See your Intel representative for details.
SATA Serial Advanced Technology Attachment is a high speed standard af82801ibn connecting storage devices such as hard disk drives and optical drives to a motherboard. If you find any discrepancy, pls be free to contact us for immediate solution.
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Brand New SLB8Q AFIBM Notebook Motherboard Chipset | eBay
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1x Intel AF82801IBM BGA Chipset With Lead Solder Balls
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Intel AF82801IBM SL8BQ 82801IBM BGA IC Chip with Solder Balls
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Other offers may also be available. Back to home page. Please enter 5 or 9 numbers for the ZIP Code. Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload.
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