INTEL AF82801IBM PDF

Find great deals for 1x Intel AFIBM BGA Chipset With Lead Solder Balls. Shop with confidence on eBay!. Model Number: AFIBM SLB8Q. Date Code: 1 PCS intel AFIBM SLB8Q BGA Chipset with solder balls. 1 PCS intel . AFIBM. BGA: CHIP. AFIBM S LB8Q Specifications: Manufacturer: Intel ; Product: Mobile Chipsets ; Operating Supply Voltage: V, V, V, 5 V ; Maximum Operating.

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Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Email af82801ibbm friends Share on Facebook – opens in a new window or tab Share on Twitter – opens in a new window or tab Share on Pinterest – opens in a new window or tab.

See other items More Prices may vary for other package types and shipment quantities. Please contact system vendor for more information on specific products or systems. Prices are for direct Intel customers, typically represent 1,unit iintel quantities, and are subject to change without notice. This item will ship to United Statesbut the seller has not specified shipping options.

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Learn more – opens in new window af82801kbm tab. Mouse over to Zoom – Click to enlarge. The chips will, as a result, die.

Intel refers to these processors as tray or OEM processors. The temperatures listed above are the chip’s solder balls actual temperatures they are measured by the measuring wire on the Fa82801ibm machine ,but not the temperatures from the BGA rework station’s top bottom heat guns.

This is a private listing and your identity will not be disclosed to anyone except the seller. Listing of these RCP does not constitute a formal pricing offer from Intel.

See your Intel representative for details.

SATA Serial Advanced Technology Attachment is a high speed standard af82801ibn connecting storage devices such as hard disk drives and optical drives to a motherboard. If you find any discrepancy, pls be free to contact us for immediate solution.

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Brand New SLB8Q AFIBM Notebook Motherboard Chipset | eBay

See other items More Embedded Options Available indicates products that offer ingel purchase availability for intelligent systems and embedded solutions. Shipping This item will be shipped by Registered Mail within 2 working days after full payment. Read more about the condition. Refer to eBay Return policy for more details.

1x Intel AF82801IBM BGA Chipset With Lead Solder Balls

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Intel AF82801IBM SL8BQ 82801IBM BGA IC Chip with Solder Balls

Email to friends Share on Facebook – opens in a new window or tab Share on Twitter – opens in a new window or tab Share on Pinterest – opens in a new window or tab Ac82801ibm to watch list. Select a valid country. This item will ship to Imtel Statesbut the seller has not specified shipping options. Other offers may also be available. Please enter a number less than or equal to Thanks for your understanding. Intrl additional information, see the Global Shipping Program terms and conditions – opens in a new window or tab.

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Other offers may also be available. Back to home page. Please enter 5 or 9 numbers for the ZIP Code. Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload.

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Core i7 Product Number: Special financing available Select PayPal Credit at checkout to have the option to pay over time. See Details – zf82801ibm in a new window or tab. Please refer to the Launch Date for market availability.